| |
capacity for state-of-the-art
a method of construction
matching function realization of high-accuracy
product detect capacity materialization of high speed
Know- How of automatic skill (during 14 years)
XSCAN-3080 is attachment automatic equipment.
It can a fine point PCB product skill, STACK VIA, NMBI(Nero
Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those
are Aligh and attach.
Experience a life of efficiency make product by equipment suitable
for advance a method of construction.
|
 |
Major Features |
 |
PCB / BGA inspection
-
Focus Size : 33μm, 80kv
-
Max PCB Size : 350 x 300mm |
|
|
Simple maintenance
- Sealed type's x-ray tube |
| |
|
|
|
|
|
Geometric magnification
- Geometric Enlargement ratio : 20x
- Enlargement on monitor : 300x |
|
|
High Resolution (option)
- Noise clearing capacity
- Pseudo Coloring, 3D Image |
| |
|
|
|
|
|
Automatic position teaching
and replying |
|
|
Easy to use
- Easy to use by mouse |
| |
|
|
|
|
|
Mediocrity
- Easy inspection by manal manipulator |
|
|
Inspection for BGA, PCB, MLB
- Easy input and inspect BGA input Bed
- void, short, excessive solder, insufficient
solder inspect capacity |
| |
|
|
|
|
|
Pseudo 3D image display |
|
|
User-friendly and easy to use |
|
|
Specifications |
| X-ray Tube |
| Focus Size |
33μm |
| Tube Current/Voltage/Power |
Max. 250μA/ 80kV/ 15W |
| Geometric Enlargement Ratio |
3x to 20x |
| Enlargement Ratio on the Monitor |
10x to 3000x |
| Aging (Preheating) |
Automatic |
| X-ray shield box and others |
| Dimension and Weight |
540mm x 550mm x 1000mm (WxDxH), 150kg |
| Externally leaking dose |
1uSv/h or less |
| Power Supply |
220VAC±10% 50/60Hz |
|
|
|
|
