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| HOME / Technology Information / BGA IC Soldering Technology / Overview of X-Ray Examination Equipment |
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Applications of X-ray Examination Technology |
Hidden solder joint (ex BGA)
Densely packed solder joint (ex BGA) for which installation of test probe is difficult
Areas for which camera photography is difficult due to mirror surface
(ex, solder joint monitoring equipment following Reflow process)
Advantage: expedient examination (vs destructive examination) |
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Purposes of Usage |
- Detection of defectiveness :
Key examination items: bridging, open, insufficient, excess,
missing balls, misregistration,
package "popcorning",
- Analysis of error in procedure :
Trend analysis: solder volume, solder joint shape
- Quality analysis |
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For effective examination |
- X-ray image acquisition technology
- Understanding of technology of X-ray image analysis |
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Technology for acquisition of X-ray image (Solder Joint examination area) |
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- Ffilm based X-ray Inspection
Process is complex, need specialization,
slow, Although high cost of image taking, one
can obtain precision image.
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Figure 46 X-ray
Laminography
Images of CBGA Solder Joints
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- Ffilm based X-ray Inspection
Process is complex, need specialization, slow,
Although high cost of image taking,
one can obtain precision image. |
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- Real time X-ray system
Although the disadvantages of Film based
technology has been overcome, there are
problems of Voltage blooming and pincushion
distortion
→ Overcome with Flat Detector technology,
high cost
- Diverse range of sizes:
desk top~10 M x 10 M
Diverse range of voltages: several kV ~ several
hundreds of kV
- What is the Voltage appropriate for BGA
examination?
Structure of copper thermal radiator
requires Higher Voltage
High-Sensitivity camera
requires Lower Voltage |
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Figure 44 X-Ray Can Be
Used to Detect BGA
Package
"Popcorning" (PincushionDistortion) |
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Technologies for Analysis of Soldering Status |
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>Transmission |
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It=Io exp(-¥ìT), appears darker if the thickness of
the lead is thicker.
Lines are expressed as points
without distinction of front from the back
Collection
of cone shaped lines.
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>Scanning Acoustic Microscopy (SAM) |
Ultrasound wave, examine by immersing in medium
(water, alcohol), 230 MHz → 25 μGap
a-SAM - point
b-SAM - line
c-SAM - surface
Effective in examination of void within under fill |
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>Feeler Gage
Gap gauge, measurement of stand-off of rectangular corner, inaccurate
convenient, low cost
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>BGA Stand-off measurement
laser, contact sensor
reflow - uniformity,
0.75mm ball
0.60mm → 0.45 mm , after reflow |
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>Destructiveanalysis methods
From the perspective of solving
problem, destruction of samplebr
- Cross-sectioning
Molded with resin ->presumption of
location There are many
cases of accidental occurrence of
open and crack in the process of
examination.
- Dye Penetrant
Observe by infiltrating with dye and
fluorescent material (UV light)
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A BGA inspection that is produced by XAVIS is a well made X-ray inspection. XAVIS’ BGA inspection is highly efficient and low priced equipment that can be used for hidden solder joint, densely packed solder joint for which installation of test probe is difficult and areas for which camera photography is difficult due to mirror surface. We put our efforts on producing our BGA inspection which does not cause the destructive examination. Xavis exports BGA inspection worldwidely, and our BGA inspection gives satisfaction to our customers. Check our website for more information of BGA inspection |
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