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capacity for state-of-the-art
a method of construction
matching function realization of high-accuracy
product detect capacity materialization of high speed
Know- How of automatic skill (during 14 years)
XSCAN-7000 is attachment automatic equipment.
It can a fine point PCB product skill, STACK VIA, NMBI(Nero
Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those
are Aligh and attach.
Experience a life of efficiency make product by equipment suitable
for advance a method of construction.
Stack via
NMBI (Neo Manattan Bump Interconnection)
PCB for Flip-Chip
PCB for BGA
High Resolution Alignment (2§)
Simulation for Re-Inspection
Statistical Product Management
Auto Calibration
Closed-Type Tube
Measurement / Analysis Software |
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