| |
Repair Process |
| 3.1
Rework/Repair Philosophy |
|
|
| |
Self alignment, 50% ball off
A structure that both PCB side & BGA ball side are
showing
3 way Step
Removal ¡æ Replacement ¡æ Reflow |
| 3.2
Rework/Repair Philosophy |
|
|
| |
reballing ¡æ Reuse
Moisture removing, giving heat impact on surrounding IC
if it increases 4Deg/sec, ´ã ½×°í |
- Site dressing
Wiping off carefully with solder wick
- Flux Application
Kinds 1. Paste Flux - Sn63/pb37 solder ball
2. Solder Paste - Pb90/Sn10 solder ball
Excessive Flux ¡æ Raising bridging
- Paste Application
Preferred method, high-cost, complex process(Stencil),
fine results
- Profile Requirement
Profile Topic |
Temperature
Range |
Time Range |
| Flux Activation |
100°
- 110° C Not to exceed 120° C |
N/A |
| Flux Activation |
120°
to 150° C |
30 to
120 seconds |
| Component
Ramp Rate |
2°
to 4° C per second |
|
| Reflow
Dwell time |
Aboce
183° C |
30 to
90 seconds |
| Solder
joint Temp. Reak |
200°
to 220° C |
|
| Component
Max Temp. |
230°
C |
60 seconds |
| Board
Temperature |
Above
150° C |
Not to
exceed four minutes |
|
| Reference :
Reflow profile |
|
|
| Reference :
Soldering
inferiority terms |
|
|
³³¶« ºÒ·®¿ë¾î |
±Ô°Ý¿ë¾î |
| ³³¶« |
Solder oint |
KS |
Korean Standard |
| ¼îÆ® |
Solder Bridging |
JIS |
Japan Industries Standard |
| ³Ã³³ |
Cold Solder |
ANS |
American National Standard |
| ¹Ì³³(³³ºÎÁ·) |
Insufficient Solder |
IPC |
The Institude For Interconnection And Packaging |
| ³³¾øÀ½ |
No Solder |
JEDEC |
Joint Electronic Device Engineering Council |
| °ú³³ |
Excessive Solder |
EIA |
Electronic Industires Association |
| ¹Ì»ð(¹Ì ÀåÂø) |
Non Mounting |
MIL |
Military Specification And Standard |
| ¿À»ð(¿À ÀåÂø) |
Wrong Mounting |
|
|
| ¿ª»ð(¿ª ÀåÂø) |
Reverse Mounting |
|
|
| ³³Å©·¢ |
Solder Crack |
|
|
| ºÎÇ°Å©·¢ |
Component Crack |
|
|
| ¼Ö´õº¼ |
Solder Balls |
|
|
| Á¥À½ºÒ·® |
Non-Wetting |
|
|
| ÀϾ |
Tombstoning(Manhattan) |
|
|
| Ʋ¾îÁü |
Missing Alignment |
|
|
| µé¶ä |
Bent Lead |
|
|
| µÚÁýÈû |
Upside Down |
|
|
| À̹°(¿À¿°) |
Contamin ated Solder |
|
|
| ±âÆ÷/ÇÉȦ |
Void / Pin Holes |
|
|
| °íµå¸§ |
Icicles / Protrusions |
|
|
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¿µ¹®ÆÇ ÀÛ¾÷Ç¥ÁØÀ» ÂüÁ¶ÇÏ¿´À½. (¿¹¸¦ µé¸é, ¹Ì»ðÀ» DisplayÞä¿¡¼´Â Non InsertionÀ¸·Î
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